What is copper pour? Mesh copper pour or solid copper pour?

1. What is copper clad
The so-called copper pouring is to use the idle space on the circuit board as the reference plane, and then fill it with solid copper. These copper areas are also called pouring copper.
The significance of copper cladding lies in: reducing ground wire impedance, improving anti-interference ability; reducing voltage drop, improving power supply efficiency; connecting with ground wire, can also reduce loop area.
Also for the purpose of keeping the PCB from deforming as much as possible during soldering, most PCB manufacturers will also require PCB designers to fill the open area of the PCB with copper or grid-like ground wires. If the copper is not handled properly, it will The gain outweighs the loss. Is copper pouring "the advantage outweighs the harm" or "the harm outweighs the benefit"? We all know that in the case of high frequency, the distributed capacitance of the wiring on the printed circuit board will work. When the length is greater than 1/20 of the corresponding wavelength of the noise frequency, an antenna effect will occur, and the noise will be emitted through the wiring. If there is a poorly grounded copper pour in the PCB, the copper pour becomes a vehicle for noise transmission.
Therefore, in high-frequency circuits, don't think that if you connect a certain part of the ground wire to the ground, this is the "ground wire". The ground plane of the shelf is "well grounded". If the copper cladding is handled properly, the copper cladding can not only increase the current, but also play a dual role of shielding interference.

2. Two forms of copper cladding
There are generally two basic methods of copper pouring, namely large-area copper pouring and mesh copper plating. People often ask whether large-area copper pouring or grid copper pouring is better, and it is not easy to generalize.
why? A large area of copper clad has the dual functions of increasing current and shielding, but if a large area of copper clad is subjected to wave soldering, the board may warp or even bubble. Therefore, for large-area copper cladding, several slots are generally opened to alleviate copper foil blistering.

Pure grid copper is mainly shielding, and the effect of increasing the current is reduced. From the perspective of heat dissipation, the grid is beneficial (it reduces the heating surface of copper) and plays a certain role in electromagnetic shielding. Especially for circuits such as touch, as shown in the figure below: It should be pointed out that the grid is composed of traces in staggered directions. We know that for circuits, the width of the traces has a certain influence on the operating frequency of the circuit board. The corresponding "electrical length" (dividing the actual size by the digital frequency corresponding to the working frequency can be obtained, see related books for details).
When the working frequency is not very high, maybe the role of the grid line is not very obvious. Once the electrical length matches the working frequency, it will be very bad. You will find that the circuit can't work normally at all, and it will emit interference system work everywhere. signal of.

The suggestion is to choose according to the working conditions of the designed circuit board, and don't cling to one thing. Therefore, the multi-purpose grid with high anti-interference requirements for high-frequency circuits, and the circuits with large currents for low-frequency circuits are commonly used for complete copper laying.